低功率半导体激光联合康复新液治疗糜烂型扁平苔藓疗效观察

Low power semiconductor laser combined with Kangfuxin Liquid for erosive oral lichen planus

  • 摘要: 目的 评价半导体激光对口腔糜烂型扁平苔藓(oral lichen planus,OLP)患者缓解疼痛、加速愈合、减小糜烂面积等方面的疗效。 方法 选取2016年1月-2017年10月在我院牙周黏膜科就诊的具有两处独立病损且病理确诊为糜烂型OLP的病例30例,随机挑选一处病损作为实验组,另外一处病损作同体对照。实验组和对照组均接受含漱康复新液治疗,同时实验组还应用低功率半导体激光照射治疗,治疗分4次进行,每次持续45 s,每次间隔1 min,评估治疗前后疼痛、病损尺寸、愈合时间等指标。 结果 实验组糜烂病损平均愈合时间为(3.05±1.10) d,对照组为(8.90±2.45) d (P=0.008);实验组30例患者中,28例治疗后疼痛即刻缓解,实验组VAS疼痛评分显著低于对照组(P均< 0.05);与对照组相比,实验组病损尺寸明显减小(P< 0.05)。 结论 低功率半导体激光治疗糜烂型口腔扁平苔藓疗效肯定,可加速病损愈合。

     

    Abstract: Objective To assess the efficacy of low-level laser therapy (LLLT) for patients with erosive oral lichen planus. Methods A total of 30 patients with two separate erosions in each person were included in this study from January 2016 to October 2017. The lesions were randomly assigned into active treatment group or sham control group for each patient. Lesions assigned to active group were treated with LLLT in a single sitting, which was divided into four sessions with 45 s as a session. Lesions in the sham control group received similar treatment without LLLT. Each patient was evaluated for pain, lesion size, and time to complete healing before and after each treatment. Results The average healing time of ulcers in treatment group was (3.05±1.10) days, significantly lower than (8.90±2.45) days in the control group (P=0.008); Of the 30 patients in the experimental group, 28 experienced immediate pain relief after first treatment. VAS was significantly lower, and the lesion size was significantly smaller in treatment group (all P< 0.05). Conclusion LLLT is effective in relieving pain and reducing healing time in treatment of oral lichen planus.

     

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